Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition.
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| Title: | Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition. |
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| Authors: | Song ST Tao, D DYL Li |
| Source: | Nanotechnology. Jan2006, Vol. 17 Issue 1, p65-78. 14p. |
| Subjects: | Atomic force microscopy, Mathematical optimization, Metallic composites, Nanocrystals |
| Abstract: | Nanocrystalline metals and alloys with grain sizes smaller than 100 nm have attractedextensive interest due to their improved mechanical, physical and chemical properties.Although electrodeposition has been one of the methods for synthesizing nanocrystallinematerials, properties of nanocrystalline electrodeposits are less evaluated, especially fortribological applications or potential applications in nanoscale devices such asMEMS and NEMS. In this work, nanocrystalline and microcrystalline copperdeposits were produced by pulse and direct current electrodeposition processesrespectively. Effects of deposition parameters, such as the peak density, frequency,current-on time and current-off time of the pulse current (PC), on the grain size wereinvestigated for the purpose of process optimization. The grain size of nanocrystallinecoatings was determined using x-ray diffraction and atomic force microscopy (AFM).Mechanical and tribological properties of the deposits were investigated usingnanoindentation, nanoscratch and microscratch techniques. It was demonstrated that thenanocrystalline film was markedly superior to regularly grained film made by direct current(DC) plating; the nanocrystalline deposit shows higher hardness, lower frictioncoefficient and lower wear rate. The surface electron stability and chemical reactivityof the deposits were also evaluated by measuring their electron work function(EWF). Results indicate that the nanocrystalline surface is more electrochemicallystable than the DC-plated one. This increased stability result is attributed to theformation of a stronger and more adherent passive film on the nanocrystallinecopper, confirmed by potentiodynamic polarization and electrical contact resistancemeasurements. [ABSTRACT FROM AUTHOR] |
| Copyright of Nanotechnology is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 20148621 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Song+ST+Tao%22">Song ST Tao</searchLink><br /><searchLink fieldCode="AR" term="%22D+DYL+Li%22">D DYL Li</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Nanotechnology%22">Nanotechnology</searchLink>. Jan2006, Vol. 17 Issue 1, p65-78. 14p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Atomic+force+microscopy%22">Atomic force microscopy</searchLink><br /><searchLink fieldCode="DE" term="%22Mathematical+optimization%22">Mathematical optimization</searchLink><br /><searchLink fieldCode="DE" term="%22Metallic+composites%22">Metallic composites</searchLink><br /><searchLink fieldCode="DE" term="%22Nanocrystals%22">Nanocrystals</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Nanocrystalline metals and alloys with grain sizes smaller than 100 nm have attractedextensive interest due to their improved mechanical, physical and chemical properties.Although electrodeposition has been one of the methods for synthesizing nanocrystallinematerials, properties of nanocrystalline electrodeposits are less evaluated, especially fortribological applications or potential applications in nanoscale devices such asMEMS and NEMS. In this work, nanocrystalline and microcrystalline copperdeposits were produced by pulse and direct current electrodeposition processesrespectively. Effects of deposition parameters, such as the peak density, frequency,current-on time and current-off time of the pulse current (PC), on the grain size wereinvestigated for the purpose of process optimization. The grain size of nanocrystallinecoatings was determined using x-ray diffraction and atomic force microscopy (AFM).Mechanical and tribological properties of the deposits were investigated usingnanoindentation, nanoscratch and microscratch techniques. It was demonstrated that thenanocrystalline film was markedly superior to regularly grained film made by direct current(DC) plating; the nanocrystalline deposit shows higher hardness, lower frictioncoefficient and lower wear rate. The surface electron stability and chemical reactivityof the deposits were also evaluated by measuring their electron work function(EWF). Results indicate that the nanocrystalline surface is more electrochemicallystable than the DC-plated one. This increased stability result is attributed to theformation of a stronger and more adherent passive film on the nanocrystallinecopper, confirmed by potentiodynamic polarization and electrical contact resistancemeasurements. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Nanotechnology is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1088/0957-4484/17/1/012 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 14 StartPage: 65 Subjects: – SubjectFull: Atomic force microscopy Type: general – SubjectFull: Mathematical optimization Type: general – SubjectFull: Metallic composites Type: general – SubjectFull: Nanocrystals Type: general Titles: – TitleFull: Tribological, mechanical and electrochemical properties of nanocrystalline copper depositsproduced by pulse electrodeposition. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Song ST Tao – PersonEntity: Name: NameFull: D DYL Li IsPartOfRelationships: – BibEntity: Dates: – D: 14 M: 01 Text: Jan2006 Type: published Y: 2006 Identifiers: – Type: issn-print Value: 09574484 Numbering: – Type: volume Value: 17 – Type: issue Value: 1 Titles: – TitleFull: Nanotechnology Type: main |
| ResultId | 1 |
