Bibliographic Details
| Title: |
Transfer Processes for Thermally Stable Large-Size TFT Flexible Substrates. |
| Authors: |
Kazushige Takechi1 k.takechi@tradim.or.jp, Toshimasa Eguchi1, Hiroshi Kanoh2, Kenichi Kanemasa3, Shigeyoshi Otsuki1 |
| Source: |
IEEE Transactions on Semiconductor Manufacturing. Feb2007, Vol. 20 Issue 1, p20-25. 6p. 4 Diagrams, 2 Charts, 7 Graphs. |
| Subjects: |
Plastics, Glass etching, Glass, Thermal stresses, Adhesives |
| Abstract: |
We report on glass etching transfer processes to obtain thermally stable large-size TFT flexible substrates on plastic film bases. The transfer processes include high-pressure jet etching that allows us to achieve good etch-rate uniformity over the large area and the utilization of an adhesive having a low elastic modulus. From the experiments and simulations, we find that using an adhesive having a low elastic modulus is effective in reducing bend of the flexible substrate under thermal stresses. The simulations also predict that the reduction in the bend corresponds to the reduction in the principal stress of the adhesive, leading to the suppression of the film peeling off from the thinned glass. Using the transfer processes, we have successfully fabricated thermally stable TFT flexible substrates (300 mm x 350 mm x 200 µm) that have satisfactory electrical characteristics. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |
