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Development of a Device for Measuring the Transverse Motion of a Saw-Wire.

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Bibliographic Details
Title: Development of a Device for Measuring the Transverse Motion of a Saw-Wire.
Authors: Mizuno, Masahiro1, Iyama, Toshirou1, Kikuchi, Shinya1, Zhang, B.2
Source: Journal of Manufacturing Science & Engineering. Aug2006, Vol. 128 Issue 3, p826-834. 9p.
Subjects: Saws, Carpentry tools, Cutting (Materials), Photodiodes, Semiconductor diodes, Laser beams, Scientific experimentation, Scientific method, Experimental design
Abstract: The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160 μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160 μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy. [ABSTRACT FROM AUTHOR]
ISSN:10871357
DOI:10.1115/1.2194060