Development of a Device for Measuring the Transverse Motion of a Saw-Wire.

Saved in:
Bibliographic Details
Title: Development of a Device for Measuring the Transverse Motion of a Saw-Wire.
Authors: Mizuno, Masahiro1, Iyama, Toshirou1, Kikuchi, Shinya1, Zhang, B.2
Source: Journal of Manufacturing Science & Engineering. Aug2006, Vol. 128 Issue 3, p826-834. 9p.
Subjects: Saws, Carpentry tools, Cutting (Materials), Photodiodes, Semiconductor diodes, Laser beams, Scientific experimentation, Scientific method, Experimental design
Abstract: The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160 μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Manufacturing Science & Engineering is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 27396186
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Development of a Device for Measuring the Transverse Motion of a Saw-Wire.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Mizuno%2C+Masahiro%22">Mizuno, Masahiro</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Iyama%2C+Toshirou%22">Iyama, Toshirou</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kikuchi%2C+Shinya%22">Kikuchi, Shinya</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Zhang%2C+B%2E%22">Zhang, B.</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Manufacturing+Science+%26+Engineering%22">Journal of Manufacturing Science & Engineering</searchLink>. Aug2006, Vol. 128 Issue 3, p826-834. 9p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Saws%22">Saws</searchLink><br /><searchLink fieldCode="DE" term="%22Carpentry+tools%22">Carpentry tools</searchLink><br /><searchLink fieldCode="DE" term="%22Cutting+%28Materials%29%22">Cutting (Materials)</searchLink><br /><searchLink fieldCode="DE" term="%22Photodiodes%22">Photodiodes</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+diodes%22">Semiconductor diodes</searchLink><br /><searchLink fieldCode="DE" term="%22Laser+beams%22">Laser beams</searchLink><br /><searchLink fieldCode="DE" term="%22Scientific+experimentation%22">Scientific experimentation</searchLink><br /><searchLink fieldCode="DE" term="%22Scientific+method%22">Scientific method</searchLink><br /><searchLink fieldCode="DE" term="%22Experimental+design%22">Experimental design</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160 μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Manufacturing Science & Engineering is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=27396186
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1115/1.2194060
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 826
    Subjects:
      – SubjectFull: Saws
        Type: general
      – SubjectFull: Carpentry tools
        Type: general
      – SubjectFull: Cutting (Materials)
        Type: general
      – SubjectFull: Photodiodes
        Type: general
      – SubjectFull: Semiconductor diodes
        Type: general
      – SubjectFull: Laser beams
        Type: general
      – SubjectFull: Scientific experimentation
        Type: general
      – SubjectFull: Scientific method
        Type: general
      – SubjectFull: Experimental design
        Type: general
    Titles:
      – TitleFull: Development of a Device for Measuring the Transverse Motion of a Saw-Wire.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Mizuno, Masahiro
      – PersonEntity:
          Name:
            NameFull: Iyama, Toshirou
      – PersonEntity:
          Name:
            NameFull: Kikuchi, Shinya
      – PersonEntity:
          Name:
            NameFull: Zhang, B.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 08
              Text: Aug2006
              Type: published
              Y: 2006
          Identifiers:
            – Type: issn-print
              Value: 10871357
          Numbering:
            – Type: volume
              Value: 128
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: Journal of Manufacturing Science & Engineering
              Type: main
ResultId 1