The future role of chip-scale packaging in COTS reliability.
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| Title: | The future role of chip-scale packaging in COTS reliability. |
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| Authors: | Gurnett, Keith, Adams, Tom |
| Source: | Military & Aerospace Electronics. May2001, Vol. 12 Issue 5, p3. 3p. |
| Subjects: | Chip scale packaging, Electronic systems |
| Abstract: | Discusses the impact of ever-shrinking components for electronic systems designs on the development of chip scale packages (CSP). Use of CSP in commercial off-the-shelf military and high-reliability applications; Advantages of using CSP; History of CSP. |
| Database: | Engineering Source |
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| Abstract: | Discusses the impact of ever-shrinking components for electronic systems designs on the development of chip scale packages (CSP). Use of CSP in commercial off-the-shelf military and high-reliability applications; Advantages of using CSP; History of CSP. |
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| ISSN: | 10469079 |
