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The future role of chip-scale packaging in COTS reliability.

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Title: The future role of chip-scale packaging in COTS reliability.
Authors: Gurnett, Keith, Adams, Tom
Source: Military & Aerospace Electronics. May2001, Vol. 12 Issue 5, p3. 3p.
Subjects: Chip scale packaging, Electronic systems
Abstract: Discusses the impact of ever-shrinking components for electronic systems designs on the development of chip scale packages (CSP). Use of CSP in commercial off-the-shelf military and high-reliability applications; Advantages of using CSP; History of CSP.
Database: Engineering Source
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  Availability: 1
Header DbId: egs
DbLabel: Engineering Source
An: 4444525
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
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  Data: The future role of chip-scale packaging in COTS reliability.
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  Data: <searchLink fieldCode="JN" term="%22Military+%26+Aerospace+Electronics%22">Military & Aerospace Electronics</searchLink>. May2001, Vol. 12 Issue 5, p3. 3p.
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  Data: Discusses the impact of ever-shrinking components for electronic systems designs on the development of chip scale packages (CSP). Use of CSP in commercial off-the-shelf military and high-reliability applications; Advantages of using CSP; History of CSP.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=4444525
RecordInfo BibRecord:
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      – Code: eng
        Text: English
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        Type: general
      – SubjectFull: Electronic systems
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              Text: May2001
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              Y: 2001
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