Bibliographic Details
| Title: |
A comparison of some imidazoles in the curing of epoxy resin |
| Authors: |
Ham, Young Rok1, Kim, Sun Hee1, Shin, Young Jae2, Lee, Dong Ho1, Yang, Minhee1, Min, Ji Hye1, Shin, Jae Sup1 jsshin@chungbuk.ac.kr |
| Source: |
Journal of Industrial & Engineering Chemistry. Jul2010, Vol. 16 Issue 4, p556-559. 4p. |
| Subjects: |
Imidazoles, Epoxy resins, Curing, Electronic equipment, Calorimetry, Polymerization |
| Abstract: |
Abstract: An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180°C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. [Copyright &y& Elsevier] |
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| Database: |
Engineering Source |
