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A comparison of some imidazoles in the curing of epoxy resin

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Title: A comparison of some imidazoles in the curing of epoxy resin
Authors: Ham, Young Rok1, Kim, Sun Hee1, Shin, Young Jae2, Lee, Dong Ho1, Yang, Minhee1, Min, Ji Hye1, Shin, Jae Sup1 jsshin@chungbuk.ac.kr
Source: Journal of Industrial & Engineering Chemistry. Jul2010, Vol. 16 Issue 4, p556-559. 4p.
Subjects: Imidazoles, Epoxy resins, Curing, Electronic equipment, Calorimetry, Polymerization
Abstract: Abstract: An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180°C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. [Copyright &y& Elsevier]
Copyright of Journal of Industrial & Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 50362828
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
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  Data: A comparison of some imidazoles in the curing of epoxy resin
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  Data: <searchLink fieldCode="AR" term="%22Ham%2C+Young+Rok%22">Ham, Young Rok</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kim%2C+Sun+Hee%22">Kim, Sun Hee</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Shin%2C+Young+Jae%22">Shin, Young Jae</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Lee%2C+Dong+Ho%22">Lee, Dong Ho</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Yang%2C+Minhee%22">Yang, Minhee</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Min%2C+Ji+Hye%22">Min, Ji Hye</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Shin%2C+Jae+Sup%22">Shin, Jae Sup</searchLink><relatesTo>1</relatesTo><i> jsshin@chungbuk.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Industrial+%26+Engineering+Chemistry%22">Journal of Industrial & Engineering Chemistry</searchLink>. Jul2010, Vol. 16 Issue 4, p556-559. 4p.
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  Data: <searchLink fieldCode="DE" term="%22Imidazoles%22">Imidazoles</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Curing%22">Curing</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+equipment%22">Electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Calorimetry%22">Calorimetry</searchLink><br /><searchLink fieldCode="DE" term="%22Polymerization%22">Polymerization</searchLink>
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  Data: Abstract: An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180°C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
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  Data: <i>Copyright of Journal of Industrial & Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1016/j.jiec.2010.03.022
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      – Code: eng
        Text: English
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        PageCount: 4
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    Subjects:
      – SubjectFull: Imidazoles
        Type: general
      – SubjectFull: Epoxy resins
        Type: general
      – SubjectFull: Curing
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      – SubjectFull: Electronic equipment
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              Text: Jul2010
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