Bibliographic Details
| Title: |
Facile preparation of superhydrophobic copper surface by HNO3 etching technique with the assistance of CTAB and ultrasonication |
| Authors: |
Pan, Lining1, Dong, Huiru donghr@mail.buct.edu.cn, Bi, Pengyu1 |
| Source: |
Applied Surface Science. Dec2010, Vol. 257 Issue 5, p1707-1711. 5p. |
| Subjects: |
Copper, Sonication, Morphology, Substrates (Materials science), Scanning electron microscopy, X-ray photoelectron spectroscopy, Contact angle |
| Abstract: |
Abstract: Superhydrophobic rough structure was prepared on copper wafer via HNO3 etching technique with the assistance of Cetyltrimethyl Ammonium Bromide (CTAB) and ultrasonication. After modification of 1H,1H,2H,2H-perfluorodecyltriethoxysilane (FDTES), the copper wafer showed stable superhydrophobicity. The morphologies, chemical compositions and hydrophobicity of the substrates were analyzed by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and water contact angle measurement. Dense and spherical micropits appeared on copper wafer after it was etched by 5M nitric acid with 1.2mM CTAB under ultrasonication for 20min. The SEM results indicated that the joint action of CTAB and ultrasonication caused the formation of dense and spherical micropits. [ABSTRACT FROM AUTHOR] |
|
Copyright of Applied Surface Science is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| Database: |
Engineering Source |
