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Facile preparation of superhydrophobic copper surface by HNO3 etching technique with the assistance of CTAB and ultrasonication

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Title: Facile preparation of superhydrophobic copper surface by HNO3 etching technique with the assistance of CTAB and ultrasonication
Authors: Pan, Lining1, Dong, Huiru donghr@mail.buct.edu.cn, Bi, Pengyu1
Source: Applied Surface Science. Dec2010, Vol. 257 Issue 5, p1707-1711. 5p.
Subjects: Copper, Sonication, Morphology, Substrates (Materials science), Scanning electron microscopy, X-ray photoelectron spectroscopy, Contact angle
Abstract: Abstract: Superhydrophobic rough structure was prepared on copper wafer via HNO3 etching technique with the assistance of Cetyltrimethyl Ammonium Bromide (CTAB) and ultrasonication. After modification of 1H,1H,2H,2H-perfluorodecyltriethoxysilane (FDTES), the copper wafer showed stable superhydrophobicity. The morphologies, chemical compositions and hydrophobicity of the substrates were analyzed by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and water contact angle measurement. Dense and spherical micropits appeared on copper wafer after it was etched by 5M nitric acid with 1.2mM CTAB under ultrasonication for 20min. The SEM results indicated that the joint action of CTAB and ultrasonication caused the formation of dense and spherical micropits. [ABSTRACT FROM AUTHOR]
Copyright of Applied Surface Science is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 54605395
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PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Facile preparation of superhydrophobic copper surface by HNO<subscript>3</subscript> etching technique with the assistance of CTAB and ultrasonication
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Pan%2C+Lining%22">Pan, Lining</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Dong%2C+Huiru%22">Dong, Huiru</searchLink><i> donghr@mail.buct.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Bi%2C+Pengyu%22">Bi, Pengyu</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Applied+Surface+Science%22">Applied Surface Science</searchLink>. Dec2010, Vol. 257 Issue 5, p1707-1711. 5p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Sonication%22">Sonication</searchLink><br /><searchLink fieldCode="DE" term="%22Morphology%22">Morphology</searchLink><br /><searchLink fieldCode="DE" term="%22Substrates+%28Materials+science%29%22">Substrates (Materials science)</searchLink><br /><searchLink fieldCode="DE" term="%22Scanning+electron+microscopy%22">Scanning electron microscopy</searchLink><br /><searchLink fieldCode="DE" term="%22X-ray+photoelectron+spectroscopy%22">X-ray photoelectron spectroscopy</searchLink><br /><searchLink fieldCode="DE" term="%22Contact+angle%22">Contact angle</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Abstract: Superhydrophobic rough structure was prepared on copper wafer via HNO3 etching technique with the assistance of Cetyltrimethyl Ammonium Bromide (CTAB) and ultrasonication. After modification of 1H,1H,2H,2H-perfluorodecyltriethoxysilane (FDTES), the copper wafer showed stable superhydrophobicity. The morphologies, chemical compositions and hydrophobicity of the substrates were analyzed by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) and water contact angle measurement. Dense and spherical micropits appeared on copper wafer after it was etched by 5M nitric acid with 1.2mM CTAB under ultrasonication for 20min. The SEM results indicated that the joint action of CTAB and ultrasonication caused the formation of dense and spherical micropits. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Applied Surface Science is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.apsusc.2010.09.001
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 1707
    Subjects:
      – SubjectFull: Copper
        Type: general
      – SubjectFull: Sonication
        Type: general
      – SubjectFull: Morphology
        Type: general
      – SubjectFull: Substrates (Materials science)
        Type: general
      – SubjectFull: Scanning electron microscopy
        Type: general
      – SubjectFull: X-ray photoelectron spectroscopy
        Type: general
      – SubjectFull: Contact angle
        Type: general
    Titles:
      – TitleFull: Facile preparation of superhydrophobic copper surface by HNO3 etching technique with the assistance of CTAB and ultrasonication
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Pan, Lining
      – PersonEntity:
          Name:
            NameFull: Dong, Huiru
      – PersonEntity:
          Name:
            NameFull: Bi, Pengyu
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 15
              M: 12
              Text: Dec2010
              Type: published
              Y: 2010
          Identifiers:
            – Type: issn-print
              Value: 01694332
          Numbering:
            – Type: volume
              Value: 257
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Applied Surface Science
              Type: main
ResultId 1