InGaAs/InP DHBTs in a Dry-Etched Refractory Metal Emitter Process Demonstrating Simultaneous f\tau/f\max \sim \430/800\ \GHz.

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Title: InGaAs/InP DHBTs in a Dry-Etched Refractory Metal Emitter Process Demonstrating Simultaneous f\tau/f\max \sim \430/800\ \GHz.
Authors: Jain, Vibhor1, Lobisser, Evan1, Baraskar, Ashish1, Thibeault, Brian J.1, Rodwell, Mark J. W.1, Griffith, Z.2, Urteaga, M.2, Loubychev, D.3, Snyder, A.3, Wu, Y.4, Fastenau, J. M.3, Liu, W. K.4
Source: IEEE Electron Device Letters. 01/01/2011, Vol. 32 Issue 1, p24-26. 3p.
Subjects: Bipolar transistors, Heterojunctions, Indium phosphide, Heat resistant alloys, Microfabrication, Plasma etching, Electric lines, Radio frequency
Abstract: We report an \InP/In0.53\Ga0.47\As/InP double heterojunction bipolar transistor (DHBT) demonstrating simultaneous 430-GHz f\tau and 800-GHz f \max. The devices were fabricated using a triple mesa process with dry-etched refractory metals for emitter contact formation. The devices incorporate a 30-nm-thick InP emitter semiconductor which enables a wet-etch emitter process demonstrating 270-nm-wide emitter–base junctions. At peak RF performance, the device is operating at 30 \mW/\mu\m^2 with Jc = \18.4\ \mA/\mu\m^{2} and Vce = \1.64\ \V. The devices show a peak DC common-emitter current gain (\beta) \sim \20 and VBR, {CEO} = \2.5\ \V. [ABSTRACT FROM AUTHOR]
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Electron+Device+Letters%22">IEEE Electron Device Letters</searchLink>. 01/01/2011, Vol. 32 Issue 1, p24-26. 3p.
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  Data: We report an \InP/In0.53\Ga0.47\As/InP double heterojunction bipolar transistor (DHBT) demonstrating simultaneous 430-GHz f\tau and 800-GHz f \max. The devices were fabricated using a triple mesa process with dry-etched refractory metals for emitter contact formation. The devices incorporate a 30-nm-thick InP emitter semiconductor which enables a wet-etch emitter process demonstrating 270-nm-wide emitter–base junctions. At peak RF performance, the device is operating at 30 \mW/\mu\m^2 with Jc = \18.4\ \mA/\mu\m^{2} and Vce = \1.64\ \V. The devices show a peak DC common-emitter current gain (\beta) \sim \20 and VBR, {CEO} = \2.5\ \V. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Electron Device Letters is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/LED.2010.2084069
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        Type: general
      – SubjectFull: Heterojunctions
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      – SubjectFull: Indium phosphide
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      – SubjectFull: Heat resistant alloys
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              Text: 01/01/2011
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