Bibliographic Details
| Title: |
Chemical bonding of ultra low expansion glass substrates with aqueous NaOH solution |
| Authors: |
Green, Katie1, Burke, Jan jan.burke@csiro.au, Oreb, Bob1 |
| Source: |
Materials Chemistry & Physics. Oct2011, Vol. 130 Issue 1/2, p577-582. 6p. |
| Subjects: |
Chemical bonds, Thermal expansion, Metallic glasses, Solution (Chemistry), Temperature effect, Thermal analysis, Fracture mechanics, Glass etching, Shear (Mechanics) |
| Abstract: |
Abstract: We report on our research towards determining a reliable and reproducible method of bonding ULE® components for space-based instruments. Such bonded components are required to withstand considerable accelerations during launch and can be exposed to significant temperature variations. The results of tensile and shear testing of a large number of bonded samples are reported, as well as the impact of thermal cycling on bond strength. A study on the feasibility of de-bonding and re-bonding ULE parts is also described. [Copyright &y& Elsevier] |
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| Database: |
Engineering Source |
