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Chemical bonding of ultra low expansion glass substrates with aqueous NaOH solution

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Title: Chemical bonding of ultra low expansion glass substrates with aqueous NaOH solution
Authors: Green, Katie1, Burke, Jan jan.burke@csiro.au, Oreb, Bob1
Source: Materials Chemistry & Physics. Oct2011, Vol. 130 Issue 1/2, p577-582. 6p.
Subjects: Chemical bonds, Thermal expansion, Metallic glasses, Solution (Chemistry), Temperature effect, Thermal analysis, Fracture mechanics, Glass etching, Shear (Mechanics)
Abstract: Abstract: We report on our research towards determining a reliable and reproducible method of bonding ULE® components for space-based instruments. Such bonded components are required to withstand considerable accelerations during launch and can be exposed to significant temperature variations. The results of tensile and shear testing of a large number of bonded samples are reported, as well as the impact of thermal cycling on bond strength. A study on the feasibility of de-bonding and re-bonding ULE parts is also described. [Copyright &y& Elsevier]
Copyright of Materials Chemistry & Physics is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 65439978
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Chemical bonding of ultra low expansion glass substrates with aqueous NaOH solution
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  Data: <searchLink fieldCode="DE" term="%22Chemical+bonds%22">Chemical bonds</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+expansion%22">Thermal expansion</searchLink><br /><searchLink fieldCode="DE" term="%22Metallic+glasses%22">Metallic glasses</searchLink><br /><searchLink fieldCode="DE" term="%22Solution+%28Chemistry%29%22">Solution (Chemistry)</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+effect%22">Temperature effect</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+analysis%22">Thermal analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Fracture+mechanics%22">Fracture mechanics</searchLink><br /><searchLink fieldCode="DE" term="%22Glass+etching%22">Glass etching</searchLink><br /><searchLink fieldCode="DE" term="%22Shear+%28Mechanics%29%22">Shear (Mechanics)</searchLink>
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  Label: Abstract
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  Data: Abstract: We report on our research towards determining a reliable and reproducible method of bonding ULE® components for space-based instruments. Such bonded components are required to withstand considerable accelerations during launch and can be exposed to significant temperature variations. The results of tensile and shear testing of a large number of bonded samples are reported, as well as the impact of thermal cycling on bond strength. A study on the feasibility of de-bonding and re-bonding ULE parts is also described. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials Chemistry & Physics is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.matchemphys.2011.07.025
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 577
    Subjects:
      – SubjectFull: Chemical bonds
        Type: general
      – SubjectFull: Thermal expansion
        Type: general
      – SubjectFull: Metallic glasses
        Type: general
      – SubjectFull: Solution (Chemistry)
        Type: general
      – SubjectFull: Temperature effect
        Type: general
      – SubjectFull: Thermal analysis
        Type: general
      – SubjectFull: Fracture mechanics
        Type: general
      – SubjectFull: Glass etching
        Type: general
      – SubjectFull: Shear (Mechanics)
        Type: general
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      – TitleFull: Chemical bonding of ultra low expansion glass substrates with aqueous NaOH solution
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            NameFull: Green, Katie
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              Text: Oct2011
              Type: published
              Y: 2011
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              Value: 130
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