APA (7th ed.) Citation

Lau, J., Chang, C., Lee, R., Chen, T., Cheng, D., Tseng, T. J., & Lin, D. (2000). Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. Journal of Electronics Manufacturing, 10(1), 79. https://doi.org/10.1142/S0960313100000101

Chicago Style (17th ed.) Citation

Lau, John, Chris Chang, Ricky Lee, Tsung-Yuan Chen, David Cheng, Tzyy Jang Tseng, and Dyna Lin. "Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications." Journal of Electronics Manufacturing 10, no. 1 (2000): 79. https://doi.org/10.1142/S0960313100000101.

MLA (9th ed.) Citation

Lau, John, et al. "Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications." Journal of Electronics Manufacturing, vol. 10, no. 1, 2000, p. 79, https://doi.org/10.1142/S0960313100000101.