Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications.
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| Title: | Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. |
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| Authors: | Lau, John, Chang, Chris, Lee, Ricky, Chen, Tsung-Yuan, Cheng, David, Tseng, Tzyy Jang, Lin, Dyna |
| Source: | Journal of Electronics Manufacturing. Mar2000, Vol. 10 Issue 1, p79. 9p. |
| Subjects: | Integrated circuits, Chip scale packaging |
| Abstract: | A novel and low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip is presented in this study. Emphasis is placed on the design, materials, process, manufacturing, and reliability of the micro VIP substrate of a chip scale package (CSP), and of the micro VIP CSP printed circuit board (PCB) assembly. Cross-sections of samples are examined for a better understanding of the solder bump, CSP redistribution, VIP, and solder joint. Non-linear finite element analyses are used to determine the stress and strain in the copper VIP and the solder joint. Time-dependent non-linear analysis is used to predict the thermal-fatigue life of the VIP solder joint. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronics Manufacturing is the property of World Scientific Publishing Company and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 6619896 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lau%2C+John%22">Lau, John</searchLink><br /><searchLink fieldCode="AR" term="%22Chang%2C+Chris%22">Chang, Chris</searchLink><br /><searchLink fieldCode="AR" term="%22Lee%2C+Ricky%22">Lee, Ricky</searchLink><br /><searchLink fieldCode="AR" term="%22Chen%2C+Tsung-Yuan%22">Chen, Tsung-Yuan</searchLink><br /><searchLink fieldCode="AR" term="%22Cheng%2C+David%22">Cheng, David</searchLink><br /><searchLink fieldCode="AR" term="%22Tseng%2C+Tzyy+Jang%22">Tseng, Tzyy Jang</searchLink><br /><searchLink fieldCode="AR" term="%22Lin%2C+Dyna%22">Lin, Dyna</searchLink> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronics+Manufacturing%22">Journal of Electronics Manufacturing</searchLink>. Mar2000, Vol. 10 Issue 1, p79. 9p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: A novel and low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip is presented in this study. Emphasis is placed on the design, materials, process, manufacturing, and reliability of the micro VIP substrate of a chip scale package (CSP), and of the micro VIP CSP printed circuit board (PCB) assembly. Cross-sections of samples are examined for a better understanding of the solder bump, CSP redistribution, VIP, and solder joint. Non-linear finite element analyses are used to determine the stress and strain in the copper VIP and the solder joint. Time-dependent non-linear analysis is used to predict the thermal-fatigue life of the VIP solder joint. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronics Manufacturing is the property of World Scientific Publishing Company and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1142/S0960313100000101 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 79 Subjects: – SubjectFull: Integrated circuits Type: general – SubjectFull: Chip scale packaging Type: general Titles: – TitleFull: Design and Manufacturing of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lau, John – PersonEntity: Name: NameFull: Chang, Chris – PersonEntity: Name: NameFull: Lee, Ricky – PersonEntity: Name: NameFull: Chen, Tsung-Yuan – PersonEntity: Name: NameFull: Cheng, David – PersonEntity: Name: NameFull: Tseng, Tzyy Jang – PersonEntity: Name: NameFull: Lin, Dyna IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 03 Text: Mar2000 Type: published Y: 2000 Identifiers: – Type: issn-print Value: 09603131 Numbering: – Type: volume Value: 10 – Type: issue Value: 1 Titles: – TitleFull: Journal of Electronics Manufacturing Type: main |
| ResultId | 1 |
