ISTFA 2011 Wrap-Up.

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Bibliographic Details
Title: ISTFA 2011 Wrap-Up.
Authors: Walraven, Jeremy A.1 jawalra@sandia.gov
Source: Electronic Device Failure Analysis. Feb2012, Vol. 14 Issue 1, p22-23. 2p.
Subjects: Conferences & conventions, Tech Prep programs, Microelectronics Failure Analysis Desk Reference (Book), Failure Analysis in Electronics: An EDFAS Special Issue (Book), Forums
Abstract: Information about technical programs conducted at the 37th International Symposium for Testing and Failure Analysis (ISTFA 2011) held at the McEnery Convention Center in San Jose, California is presented. It states that the symposium included several technical programs, tutorials and group discussions in it. It mentions that the symposium also introduced two published books including the Microelectronics Failure Analysis Desk Reference and Failure Analysis in Electronics: An EDFAS Special Issue. INSETS: ISTFA Sponsors;EDFAS 2011 Photo Contest Winners.
Database: Engineering Source
Description
Abstract:Information about technical programs conducted at the 37th International Symposium for Testing and Failure Analysis (ISTFA 2011) held at the McEnery Convention Center in San Jose, California is presented. It states that the symposium included several technical programs, tutorials and group discussions in it. It mentions that the symposium also introduced two published books including the Microelectronics Failure Analysis Desk Reference and Failure Analysis in Electronics: An EDFAS Special Issue. INSETS: ISTFA Sponsors;EDFAS 2011 Photo Contest Winners.
ISSN:15370755
DOI:10.31399/asm.edfa.2012-1.p022