In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique.
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| Title: | In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique. |
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| Authors: | Kim, HyoungIl1 (AUTHOR), Tian, Jun2 (AUTHOR), Gupta, Vijay2 (AUTHOR) vgupta@seas.ucla.edu |
| Source: | Journal of Adhesion Science & Technology. Apr2013, Vol. 27 Issue 7, p719-730. 12p. 1 Black and White Photograph, 5 Diagrams, 2 Charts, 4 Graphs. |
| Subjects: | Wave mechanics, Chip scale packaging, Solder joints, Simulation methods & models, Industrial lasers, Spallation (Nuclear physics), Strength of materials |
| Abstract: | strengths of planar films is modified to determine the interfacial tensile strengths of sol-der joints, in situ, in board-mounted chip-scale packages (CSPs). The new technique is demonstrated on packages with bare Cu pads and Pb-free solders. The solder/pad inter-face strength is determined by first using a laser-generated stress wave to separate the geometrically heterogeneous interface, in situ, and then quantifying the failure stress by a combination of interferometry and wave mechanics simulation. The solder to pad interfacial strengths were found to be 705 ±102, 510 ±71, and 369±55MPa for pack-ages stressed by baking at 150°C for 0, 48, and lOOh, respectively. The interface strengths were found to be roughly proportional to the critical laser energies for separa-tion of solder joints. Thus, it may suffice to use the critical laser energy as a parameter for the purposes of material selection and solder joint quality inspection during manu-facturing. The quantitative capability of the LS test for testing board-level packages now provides an opportunity to enhance the board-level drop test that is widely con-ducted in the industry today. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Abstract: | strengths of planar films is modified to determine the interfacial tensile strengths of sol-der joints, in situ, in board-mounted chip-scale packages (CSPs). The new technique is demonstrated on packages with bare Cu pads and Pb-free solders. The solder/pad inter-face strength is determined by first using a laser-generated stress wave to separate the geometrically heterogeneous interface, in situ, and then quantifying the failure stress by a combination of interferometry and wave mechanics simulation. The solder to pad interfacial strengths were found to be 705 ±102, 510 ±71, and 369±55MPa for pack-ages stressed by baking at 150°C for 0, 48, and lOOh, respectively. The interface strengths were found to be roughly proportional to the critical laser energies for separa-tion of solder joints. Thus, it may suffice to use the critical laser energy as a parameter for the purposes of material selection and solder joint quality inspection during manu-facturing. The quantitative capability of the LS test for testing board-level packages now provides an opportunity to enhance the board-level drop test that is widely con-ducted in the industry today. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 01694243 |
| DOI: | 10.1080/01694243.2012.705546 |
