APA (7th ed.) Citation

Kim, H., Tian, J., & Gupta, V. (2013). In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique. Journal of Adhesion Science & Technology, 27(7), 719. https://doi.org/10.1080/01694243.2012.705546

Chicago Style (17th ed.) Citation

Kim, HyoungIl, Jun Tian, and Vijay Gupta. "In-situ Measurement of Solder Joint Strength in Board-mounted Chip-scale Packages Using a Quantitative Laser Spallation Technique." Journal of Adhesion Science & Technology 27, no. 7 (2013): 719. https://doi.org/10.1080/01694243.2012.705546.

MLA (9th ed.) Citation

Kim, HyoungIl, et al. "In-situ Measurement of Solder Joint Strength in Board-mounted Chip-scale Packages Using a Quantitative Laser Spallation Technique." Journal of Adhesion Science & Technology, vol. 27, no. 7, 2013, p. 719, https://doi.org/10.1080/01694243.2012.705546.