In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique.
Saved in:
| Title: | In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique. |
|---|---|
| Authors: | Kim, HyoungIl1 (AUTHOR), Tian, Jun2 (AUTHOR), Gupta, Vijay2 (AUTHOR) vgupta@seas.ucla.edu |
| Source: | Journal of Adhesion Science & Technology. Apr2013, Vol. 27 Issue 7, p719-730. 12p. 1 Black and White Photograph, 5 Diagrams, 2 Charts, 4 Graphs. |
| Subjects: | Wave mechanics, Chip scale packaging, Solder joints, Simulation methods & models, Industrial lasers, Spallation (Nuclear physics), Strength of materials |
| Abstract: | strengths of planar films is modified to determine the interfacial tensile strengths of sol-der joints, in situ, in board-mounted chip-scale packages (CSPs). The new technique is demonstrated on packages with bare Cu pads and Pb-free solders. The solder/pad inter-face strength is determined by first using a laser-generated stress wave to separate the geometrically heterogeneous interface, in situ, and then quantifying the failure stress by a combination of interferometry and wave mechanics simulation. The solder to pad interfacial strengths were found to be 705 ±102, 510 ±71, and 369±55MPa for pack-ages stressed by baking at 150°C for 0, 48, and lOOh, respectively. The interface strengths were found to be roughly proportional to the critical laser energies for separa-tion of solder joints. Thus, it may suffice to use the critical laser energy as a parameter for the purposes of material selection and solder joint quality inspection during manu-facturing. The quantitative capability of the LS test for testing board-level packages now provides an opportunity to enhance the board-level drop test that is widely con-ducted in the industry today. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
|
Full text is not displayed to guests.
Login for full access.
|
|
| FullText | Links: – Type: pdflink Text: Availability: 1 |
|---|---|
| Header | DbId: egs DbLabel: Engineering Source An: 87315049 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Kim%2C+HyoungIl%22">Kim, HyoungIl</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Tian%2C+Jun%22">Tian, Jun</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Gupta%2C+Vijay%22">Gupta, Vijay</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> vgupta@seas.ucla.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. Apr2013, Vol. 27 Issue 7, p719-730. 12p. 1 Black and White Photograph, 5 Diagrams, 2 Charts, 4 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Wave+mechanics%22">Wave mechanics</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+methods+%26+models%22">Simulation methods & models</searchLink><br /><searchLink fieldCode="DE" term="%22Industrial+lasers%22">Industrial lasers</searchLink><br /><searchLink fieldCode="DE" term="%22Spallation+%28Nuclear+physics%29%22">Spallation (Nuclear physics)</searchLink><br /><searchLink fieldCode="DE" term="%22Strength+of+materials%22">Strength of materials</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: strengths of planar films is modified to determine the interfacial tensile strengths of sol-der joints, in situ, in board-mounted chip-scale packages (CSPs). The new technique is demonstrated on packages with bare Cu pads and Pb-free solders. The solder/pad inter-face strength is determined by first using a laser-generated stress wave to separate the geometrically heterogeneous interface, in situ, and then quantifying the failure stress by a combination of interferometry and wave mechanics simulation. The solder to pad interfacial strengths were found to be 705 ±102, 510 ±71, and 369±55MPa for pack-ages stressed by baking at 150°C for 0, 48, and lOOh, respectively. The interface strengths were found to be roughly proportional to the critical laser energies for separa-tion of solder joints. Thus, it may suffice to use the critical laser energy as a parameter for the purposes of material selection and solder joint quality inspection during manu-facturing. The quantitative capability of the LS test for testing board-level packages now provides an opportunity to enhance the board-level drop test that is widely con-ducted in the industry today. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=87315049 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1080/01694243.2012.705546 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 719 Subjects: – SubjectFull: Wave mechanics Type: general – SubjectFull: Chip scale packaging Type: general – SubjectFull: Solder joints Type: general – SubjectFull: Simulation methods & models Type: general – SubjectFull: Industrial lasers Type: general – SubjectFull: Spallation (Nuclear physics) Type: general – SubjectFull: Strength of materials Type: general Titles: – TitleFull: In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Kim, HyoungIl – PersonEntity: Name: NameFull: Tian, Jun – PersonEntity: Name: NameFull: Gupta, Vijay IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 04 Text: Apr2013 Type: published Y: 2013 Identifiers: – Type: issn-print Value: 01694243 Numbering: – Type: volume Value: 27 – Type: issue Value: 7 Titles: – TitleFull: Journal of Adhesion Science & Technology Type: main |
| ResultId | 1 |
