Bibliographic Details
| Title: |
Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments. |
| Authors: |
Testa, F.1,2, Coetsier, C.1, Carretier, E.1, Ennahali, M.2, Laborie, B.2, Moulin, P.1 philippe.moulin@univ-amu.fr |
| Source: |
Microelectronic Engineering. Jan2014, Vol. 113, p114-122. 9p. |
| Subjects: |
Slurry, Solid waste, Waste recycling, Tungsten, Additives, Mechanical behavior of materials, Chemical vapor deposition |
| Abstract: |
Highlights: [•] Effects of chemical additives in slurry on tungsten CMP (W-CMP). [•] Experiments under static and dynamic conditions and results. [•] Discrimination effects of chemistry on the mechanical removal of tungsten. [•] Design of experiments methodology. [•] Recycle polishing slurries to reduce consumables, the limitation of industrial water rejection and lower solid wastes. [ABSTRACT FROM AUTHOR] |
|
Copyright of Microelectronic Engineering is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| Database: |
Engineering Source |
