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Chapter 1: Introduction: Survey Overview and Outline.

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Bibliographic Details
Title: Chapter 1: Introduction: Survey Overview and Outline.
Authors: Sabry, Mohamed M.1 mohamed.sabry@epfl.ch, Atienza, David1 david.atienza@epfl.ch
Source: Foundations & Trends in Electronic Design Automation. 2014, Vol. 8 Issue 2, p131-133. 3p.
Subjects: Multicore processors, Computer cooling, Performance of multiprocessors, Thermal management (Electronic packaging), Three-dimensional display systems
Abstract: The article discusses findings of a survey that examines temperature aware design optimizations and run-time management schemes for three-dimensional multiprocessor systems-on-chips (3D MPSoCs) as of 2014. Topics discussed include thermal impact on the reliability of 3D MPSoCs, effects of advanced cooling mechanisms such as thermal-through-silicon vias (TTSVs) and interlayer liquid cooling on 3D MPSoCs, and run-time thermal management mechanisms. Also referred are other surveys on same subject.
Database: Engineering Source
Description
Abstract:The article discusses findings of a survey that examines temperature aware design optimizations and run-time management schemes for three-dimensional multiprocessor systems-on-chips (3D MPSoCs) as of 2014. Topics discussed include thermal impact on the reliability of 3D MPSoCs, effects of advanced cooling mechanisms such as thermal-through-silicon vias (TTSVs) and interlayer liquid cooling on 3D MPSoCs, and run-time thermal management mechanisms. Also referred are other surveys on same subject.
ISSN:15513939