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Chapter 1: Introduction: Survey Overview and Outline.

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Title: Chapter 1: Introduction: Survey Overview and Outline.
Authors: Sabry, Mohamed M.1 mohamed.sabry@epfl.ch, Atienza, David1 david.atienza@epfl.ch
Source: Foundations & Trends in Electronic Design Automation. 2014, Vol. 8 Issue 2, p131-133. 3p.
Subjects: Multicore processors, Computer cooling, Performance of multiprocessors, Thermal management (Electronic packaging), Three-dimensional display systems
Abstract: The article discusses findings of a survey that examines temperature aware design optimizations and run-time management schemes for three-dimensional multiprocessor systems-on-chips (3D MPSoCs) as of 2014. Topics discussed include thermal impact on the reliability of 3D MPSoCs, effects of advanced cooling mechanisms such as thermal-through-silicon vias (TTSVs) and interlayer liquid cooling on 3D MPSoCs, and run-time thermal management mechanisms. Also referred are other surveys on same subject.
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 94137168
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Chapter 1: Introduction: Survey Overview and Outline.
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  Data: <searchLink fieldCode="AR" term="%22Sabry%2C+Mohamed+M%2E%22">Sabry, Mohamed M.</searchLink><relatesTo>1</relatesTo><i> mohamed.sabry@epfl.ch</i><br /><searchLink fieldCode="AR" term="%22Atienza%2C+David%22">Atienza, David</searchLink><relatesTo>1</relatesTo><i> david.atienza@epfl.ch</i>
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  Data: <searchLink fieldCode="JN" term="%22Foundations+%26+Trends+in+Electronic+Design+Automation%22">Foundations & Trends in Electronic Design Automation</searchLink>. 2014, Vol. 8 Issue 2, p131-133. 3p.
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  Label: Subjects
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  Data: <searchLink fieldCode="DE" term="%22Multicore+processors%22">Multicore processors</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+cooling%22">Computer cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Performance+of+multiprocessors%22">Performance of multiprocessors</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+management+%28Electronic+packaging%29%22">Thermal management (Electronic packaging)</searchLink><br /><searchLink fieldCode="DE" term="%22Three-dimensional+display+systems%22">Three-dimensional display systems</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The article discusses findings of a survey that examines temperature aware design optimizations and run-time management schemes for three-dimensional multiprocessor systems-on-chips (3D MPSoCs) as of 2014. Topics discussed include thermal impact on the reliability of 3D MPSoCs, effects of advanced cooling mechanisms such as thermal-through-silicon vias (TTSVs) and interlayer liquid cooling on 3D MPSoCs, and run-time thermal management mechanisms. Also referred are other surveys on same subject.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=94137168
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 3
        StartPage: 131
    Subjects:
      – SubjectFull: Multicore processors
        Type: general
      – SubjectFull: Computer cooling
        Type: general
      – SubjectFull: Performance of multiprocessors
        Type: general
      – SubjectFull: Thermal management (Electronic packaging)
        Type: general
      – SubjectFull: Three-dimensional display systems
        Type: general
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      – TitleFull: Chapter 1: Introduction: Survey Overview and Outline.
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            NameFull: Sabry, Mohamed M.
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            NameFull: Atienza, David
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            – D: 01
              M: 05
              Text: 2014
              Type: published
              Y: 2014
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            – TitleFull: Foundations & Trends in Electronic Design Automation
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