Bibliographic Details
| Title: |
A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems. |
| Authors: |
Haque, Razi-ul M.1, Wise, Kensall D.2 |
| Source: |
Journal of Microelectromechanical Systems. Dec2013, Vol. 22 Issue 6, p1470-1477. 8p. |
| Subjects: |
Borosilicates, Glass etching, Silicon research, Micromechanics |
| Abstract: |
This paper reports a new batch-mode fabrication process that combines glass and silicon into a single wafer. The technique requires only a single mask to lithographically define recesses in silicon using deep reactive ion etching. The patterned silicon wafer is anodically bonded to a glass wafer, and a high-temperature step reflows the glass into this silicon mold. The reflowed wafer stack is then planarized and thinned. Through-glass vias can be realized in this manner while additional process-flow modifications enable features such as molded cavities in the glass. A capacitive pressure sensor and a hermetically sealed resonator are described to illustrate applications of the process. Finally, a three dimensional packaging technique for implantable biomedical microsystems is shown by vertically stacking glass-in-silicon wafers. \hfill[2012\-0348] [ABSTRACT FROM PUBLISHER] |
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| Database: |
Engineering Source |
