A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems.
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| Title: | A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems. |
|---|---|
| Authors: | Haque, Razi-ul M.1, Wise, Kensall D.2 |
| Source: | Journal of Microelectromechanical Systems. Dec2013, Vol. 22 Issue 6, p1470-1477. 8p. |
| Subjects: | Borosilicates, Glass etching, Silicon research, Micromechanics |
| Abstract: | This paper reports a new batch-mode fabrication process that combines glass and silicon into a single wafer. The technique requires only a single mask to lithographically define recesses in silicon using deep reactive ion etching. The patterned silicon wafer is anodically bonded to a glass wafer, and a high-temperature step reflows the glass into this silicon mold. The reflowed wafer stack is then planarized and thinned. Through-glass vias can be realized in this manner while additional process-flow modifications enable features such as molded cavities in the glass. A capacitive pressure sensor and a hermetically sealed resonator are described to illustrate applications of the process. Finally, a three dimensional packaging technique for implantable biomedical microsystems is shown by vertically stacking glass-in-silicon wafers. \hfill[2012\-0348] [ABSTRACT FROM PUBLISHER] |
| Copyright of Journal of Microelectromechanical Systems is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 95451336 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Haque%2C+Razi-ul+M%2E%22">Haque, Razi-ul M.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Wise%2C+Kensall+D%2E%22">Wise, Kensall D.</searchLink><relatesTo>2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectromechanical+Systems%22">Journal of Microelectromechanical Systems</searchLink>. Dec2013, Vol. 22 Issue 6, p1470-1477. 8p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Borosilicates%22">Borosilicates</searchLink><br /><searchLink fieldCode="DE" term="%22Glass+etching%22">Glass etching</searchLink><br /><searchLink fieldCode="DE" term="%22Silicon+research%22">Silicon research</searchLink><br /><searchLink fieldCode="DE" term="%22Micromechanics%22">Micromechanics</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: This paper reports a new batch-mode fabrication process that combines glass and silicon into a single wafer. The technique requires only a single mask to lithographically define recesses in silicon using deep reactive ion etching. The patterned silicon wafer is anodically bonded to a glass wafer, and a high-temperature step reflows the glass into this silicon mold. The reflowed wafer stack is then planarized and thinned. Through-glass vias can be realized in this manner while additional process-flow modifications enable features such as molded cavities in the glass. A capacitive pressure sensor and a hermetically sealed resonator are described to illustrate applications of the process. Finally, a three dimensional packaging technique for implantable biomedical microsystems is shown by vertically stacking glass-in-silicon wafers. \hfill[2012\-0348] [ABSTRACT FROM PUBLISHER] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Microelectromechanical Systems is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=95451336 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/JMEMS.2013.2265851 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 1470 Subjects: – SubjectFull: Borosilicates Type: general – SubjectFull: Glass etching Type: general – SubjectFull: Silicon research Type: general – SubjectFull: Micromechanics Type: general Titles: – TitleFull: A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Haque, Razi-ul M. – PersonEntity: Name: NameFull: Wise, Kensall D. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2013 Type: published Y: 2013 Identifiers: – Type: issn-print Value: 10577157 Numbering: – Type: volume Value: 22 – Type: issue Value: 6 Titles: – TitleFull: Journal of Microelectromechanical Systems Type: main |
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