Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps.
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| Title: | Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps. |
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| Authors: | Chang-Chun Lee1, Po Ting Lin1 potinglin@cycu.edu.tw |
| Source: | Journal of Electronic Packaging. Sep2014, Vol. 136 Issue 3, p1-9. 9p. |
| Subjects: | Microelectronics industry, Integrated circuits, Finite element method, Integrated circuit interconnections, Electronic packaging |
| Abstract: | In the latest microelectronics industry, the emerging three-dimensional (3D) chip stacking technique using through silicon via (TSV) enables higher integration density that allows greater numbers of interconnections in order to fulfill the urgent requirements of dimensional downscaling and electrical speed enhancement. A high-density pitch of microbumps associated with the wafer-level underfill (WLUF) under a thermal compressions process are utilized to prevent the thermomechanical failures of the microbumps due to variations of thermal expansions of different materials in the 3D package. The use of dummy microbumps has been proposed to find the acceptable thin-layer uniformity and the reliable mechanical performances of the entire packaging structure. The warpage and strain behavior of packaging structure has been simulated by finite element analysis (FEA) and compared with experimental results. The responses were parametrically modeled using Kriging model with respect to compressive force, the thickness of the top chip, and the location of the dummy microbumps. The deterministic design guidance for warpage and strain has been obtained from the Kriging model. Furthermore, the reliability of the design under uncertainty has been investigated. A reliability-based design guidance (RBDG) has been proposed to provide a safety boundary in terms of the allowable reliability index. The proposed method can be utilized as the reliability standard for high-throughput production of 3D integrated circuits (ICs) packaging. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 97925147 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Chang-Chun+Lee%22">Chang-Chun Lee</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Po+Ting+Lin%22">Po Ting Lin</searchLink><relatesTo>1</relatesTo><i> potinglin@cycu.edu.tw</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>. Sep2014, Vol. 136 Issue 3, p1-9. 9p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Microelectronics+industry%22">Microelectronics industry</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuit+interconnections%22">Integrated circuit interconnections</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: In the latest microelectronics industry, the emerging three-dimensional (3D) chip stacking technique using through silicon via (TSV) enables higher integration density that allows greater numbers of interconnections in order to fulfill the urgent requirements of dimensional downscaling and electrical speed enhancement. A high-density pitch of microbumps associated with the wafer-level underfill (WLUF) under a thermal compressions process are utilized to prevent the thermomechanical failures of the microbumps due to variations of thermal expansions of different materials in the 3D package. The use of dummy microbumps has been proposed to find the acceptable thin-layer uniformity and the reliable mechanical performances of the entire packaging structure. The warpage and strain behavior of packaging structure has been simulated by finite element analysis (FEA) and compared with experimental results. The responses were parametrically modeled using Kriging model with respect to compressive force, the thickness of the top chip, and the location of the dummy microbumps. The deterministic design guidance for warpage and strain has been obtained from the Kriging model. Furthermore, the reliability of the design under uncertainty has been investigated. A reliability-based design guidance (RBDG) has been proposed to provide a safety boundary in terms of the allowable reliability index. The proposed method can be utilized as the reliability standard for high-throughput production of 3D integrated circuits (ICs) packaging. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1115/1.4026854 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Subjects: – SubjectFull: Microelectronics industry Type: general – SubjectFull: Integrated circuits Type: general – SubjectFull: Finite element method Type: general – SubjectFull: Integrated circuit interconnections Type: general – SubjectFull: Electronic packaging Type: general Titles: – TitleFull: Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chang-Chun Lee – PersonEntity: Name: NameFull: Po Ting Lin IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: Sep2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 10437398 Numbering: – Type: volume Value: 136 – Type: issue Value: 3 Titles: – TitleFull: Journal of Electronic Packaging Type: main |
| ResultId | 1 |
