Low-cost replication of self-organized sub-micron structures into polymer films.

Saved in:

Bibliographic Details
Title:	Low-cost replication of self-organized sub-micron structures into polymer films.
Authors:	Stenberg, H.¹, Stenberg, P.², Takkunen, L.¹, Kuittinen, M.², Suvanto, M.¹, Pakkanen, T. T.¹ tuula.pakkanen@uef.fi
Source:	Express Polymer Letters. 2015, Vol. 9 Issue 2, p95-104. 10p. 2 Diagrams, 3 Charts, 4 Graphs.
Subjects:	Polystyrene, Embossing (Metalwork), Etching, Polymer films, Nickel
Abstract:	In this paper, the results of exploiting self-organized sub-micron polystyrene (PS) wrinkle patterns possessing random orientation, in preparation of a nickel stamp for hot embossing purposes, are presented. Self-organized patterns were prepared employing a method in which a stiff cross-linked capping layer on the topmost part of the soft polystyrene layer was created by using reactive ion etching (RIE) device with mild conditions and argon as a process gas, and the wrinkle formation was initiated thermally. Different surface patternings were obtained using silicon and stainless steel (SST) wafers as substrates. Prepared Ni-stamps were employed in hot embossing of polycarbonate (PC) and cyclo-olefin polymer (COP) films, using a nano-imprinting process. The replication quality of the self-organized wrinkle structures in PC and COP films was monitored by comparing the shape and dimensions of the original and final surface structures. The hot embossed sub-micron scale features, originally formed on stainless steel substrate, were found to have influence on the optical properties of the PC and COP films by lowering their reflectances. [ABSTRACT FROM AUTHOR]
	Copyright of Express Polymer Letters is the property of Budapest University of Technology & Economics and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database:	Engineering Source

Description
Abstract:	In this paper, the results of exploiting self-organized sub-micron polystyrene (PS) wrinkle patterns possessing random orientation, in preparation of a nickel stamp for hot embossing purposes, are presented. Self-organized patterns were prepared employing a method in which a stiff cross-linked capping layer on the topmost part of the soft polystyrene layer was created by using reactive ion etching (RIE) device with mild conditions and argon as a process gas, and the wrinkle formation was initiated thermally. Different surface patternings were obtained using silicon and stainless steel (SST) wafers as substrates. Prepared Ni-stamps were employed in hot embossing of polycarbonate (PC) and cyclo-olefin polymer (COP) films, using a nano-imprinting process. The replication quality of the self-organized wrinkle structures in PC and COP films was monitored by comparing the shape and dimensions of the original and final surface structures. The hot embossed sub-micron scale features, originally formed on stainless steel substrate, were found to have influence on the optical properties of the PC and COP films by lowering their reflectances. [ABSTRACT FROM AUTHOR]
ISSN:	1788618X
DOI:	10.3144/expresspolymlett.2015.11