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Life cycle assessment of integrated circuit packaging technologies.

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Bibliographic Details
Title: Life cycle assessment of integrated circuit packaging technologies.
Authors: Andrae, Anders S. G.1 anders.andrae@huawei.com, Andersen, Otto2
Source: International Journal of Life Cycle Assessment. Mar2011, Vol. 16 Issue 3, p258-267. 10p.
Database: Environment Complete
Description
ISSN:09483349
DOI:10.1007/s11367-011-0260-3