Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder.
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| Title: | Author Correction: Effect of FeCoNiCrCu |
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| Authors: | Shen YA; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan. yashen@jwri.osaka-u.ac.jp., Lin CM; Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu, 30401, Taiwan.; Department of Aviation Mechanical Engineering, China University of Science and Technology, Hsinchu, 312, Taiwan., Li J; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan.; Department of electronic engineering, City University of Hong Kong, Hong Kong, SAR, China., He S; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan.; Graduate School of engineering, Osaka University, Suita, 565-0871, Osaka, Japan., Nishikawa H; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 567-0047, Osaka, Japan. nisikawa@jwri.osaka-u.ac.jp. |
| Source: | Scientific reports [Sci Rep] 2020 Jul 22; Vol. 10 (1), pp. 12229. Date of Electronic Publication: 2020 Jul 22. |
| Publication Type: | Published Erratum |
| Journal Info: | Publisher: Nature Publishing Group Country of Publication: England NLM ID: 101563288 Publication Model: Electronic Cited Medium: Internet ISSN: 2045-2322 (Electronic) Linking ISSN: 20452322 NLM ISO Abbreviation: Sci Rep Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 2045-2322 |
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| DOI: | 10.1038/s41598-020-67126-y |
