APA (7th ed.) Citation

YA, S., CM, L., J, L., S, H., & H, N. (2020). Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder. Scientific reports, 10(1), 12229. https://doi.org/10.1038/s41598-020-67126-y

Chicago Style (17th ed.) Citation

YA, Shen, Lin CM, Li J, He S, and Nishikawa H. "Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder." Scientific Reports 10, no. 1 (2020): 12229. https://doi.org/10.1038/s41598-020-67126-y.

MLA (9th ed.) Citation

YA, Shen, et al. "Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder." Scientific Reports, vol. 10, no. 1, 2020, p. 12229, https://doi.org/10.1038/s41598-020-67126-y.