| Authors: |
Xie WF; Department of Microelectronic Science and Engineering, School of Physical Science and Technology, Ningbo University, Ningbo 315211, China. weishihao@nbu.edu.cn and College of Electronic Information and Optical Engineering, Nankai University, Tianjin, 300350, China., Zhu HR; Department of Microelectronic Science and Engineering, School of Physical Science and Technology, Ningbo University, Ningbo 315211, China. weishihao@nbu.edu.cn and College of Electronic Information and Optical Engineering, Nankai University, Tianjin, 300350, China., Wei SH; Department of Microelectronic Science and Engineering, School of Physical Science and Technology, Ningbo University, Ningbo 315211, China. weishihao@nbu.edu.cn. |