| Authors: |
Lee B; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 08826, Korea.; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea., Cho H; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 08826, Korea.; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea., Park KT; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea., Kim JS; Institute of Advanced Composite Materials, Korea Institute of Science and Technology, Wanju, Jeonbuk, 55324, Korea., Park M; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea.; KHU-KIST Department of Converging Science and Technology, Kyung Hee University, Seoul, 02447, Korea., Kim H; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea. heesukkim@kist.re.kr., Hong Y; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 08826, Korea. yongtaek@snu.ac.kr., Chung S; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul, 02792, Korea. seungjun@kist.re.kr. |
