| Authors: |
Koya AN; Istituto Italiano di Tecnologia, via Morego 30, I-16163 Genova, Italy., Zhu X; Department of Electrical and Computer Engineering, University of California, Santa Cruz, California 95064, United States., Ohannesian N; Department of Electrical and Computer Engineering, University of Houston, Houston Texas 77204, United States., Yanik AA; Department of Electrical and Computer Engineering, University of California, Santa Cruz, California 95064, United States., Alabastri A; Department of Electrical and Computer Engineering, Rice University, Houston, Texas 77005, United States., Proietti Zaccaria R; Istituto Italiano di Tecnologia, via Morego 30, I-16163 Genova, Italy.; Cixi Institute of Biomedical Engineering, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Zhejiang 315201, China., Krahne R; Istituto Italiano di Tecnologia, via Morego 30, I-16163 Genova, Italy., Shih WC; Department of Electrical and Computer Engineering, University of California, Santa Cruz, California 95064, United States., Garoli D; Istituto Italiano di Tecnologia, via Morego 30, I-16163 Genova, Italy.; Faculty of Science and Technology, Free University of Bozen, Piazza Università 5, 39100 Bolzano, Italy. |
