| Authors: |
Aryana K; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA., Stewart DA; Western Digital Corporation, San Jose, CA, USA., Gaskins JT; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA., Nag J; Western Digital Corporation, San Jose, CA, USA., Read JC; Western Digital Corporation, San Jose, CA, USA., Olson DH; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA., Grobis MK; Western Digital Corporation, San Jose, CA, USA., Hopkins PE; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu.; Department of Materials Science and Engineering, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu.; Department of Physics, University of Virginia, Charlottesville, VA, USA. phopkins@virginia.edu. |
