| Authors: |
Huff JS; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Turner DB; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Mass OA; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Patten LK; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Wilson CK; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Roy SK; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Barclay MS; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Yurke B; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Knowlton WB; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Davis PH; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Pensack RD; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States. |