| Authors: |
Biaggne A; Micron School of Materials Science and Engineering, Boise State University Boise ID 83725 USA lanli@boisestate.edu., Kim YC; Materials Science and Technology Division, U.S. Naval Research Laboratory Washington DC 20375 USA., Melinger JS; Electronics Science and Technology Division, U.S. Naval Research Laboratory Washington DC 20375 USA., Knowlton WB; Micron School of Materials Science and Engineering, Boise State University Boise ID 83725 USA lanli@boisestate.edu.; Department of Electrical and Computer Engineering, Boise State University Boise ID 83725 USA., Yurke B; Micron School of Materials Science and Engineering, Boise State University Boise ID 83725 USA lanli@boisestate.edu.; Department of Electrical and Computer Engineering, Boise State University Boise ID 83725 USA., Li L; Micron School of Materials Science and Engineering, Boise State University Boise ID 83725 USA lanli@boisestate.edu.; Center for Advanced Energy Studies Idaho Falls ID 83401 USA. |
