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Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.

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Bibliographic Details
Title: Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
Authors: Bargiel S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Cogan J; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Queste S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Oliveri S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Gauthier-Manuel L; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Raschetti M; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Leroy O; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Beurthey S; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Perrin-Terrin M; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France.
Source: Micromachines [Micromachines (Basel)] 2023 Jun 24; Vol. 14 (7). Date of Electronic Publication: 2023 Jun 24.
Publication Type: Journal Article
Journal Info: Publisher: MDPI Country of Publication: Switzerland NLM ID: 101640903 Publication Model: Electronic Cited Medium: Print ISSN: 2072-666X (Print) Linking ISSN: 2072666X NLM ISO Abbreviation: Micromachines (Basel) Subsets: PubMed not MEDLINE
Database: MEDLINE Ultimate
Description
ISSN:2072-666X
DOI:10.3390/mi14071297