APA (7th ed.) Citation

S, B., J, C., S, Q., S, O., L, G., M, R., . . . M, P. (2023). Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. Micromachines, 14(7), . https://doi.org/10.3390/mi14071297

Chicago Style (17th ed.) Citation

S, Bargiel, Cogan J, Queste S, Oliveri S, Gauthier-Manuel L, Raschetti M, Leroy O, Beurthey S, and Perrin-Terrin M. "Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices." Micromachines 14, no. 7 (2023). https://doi.org/10.3390/mi14071297.

MLA (9th ed.) Citation

S, Bargiel, et al. "Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices." Micromachines, vol. 14, no. 7, 2023, https://doi.org/10.3390/mi14071297.