Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices.
Saved in:
| Title: | Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices. |
|---|---|
| Authors: | Bargiel S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Cogan J; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Queste S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Oliveri S; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Gauthier-Manuel L; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Raschetti M; Institut FEMTO-ST, CNRS, Université de Franche-Comté, F-25000 Besançon, France., Leroy O; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Beurthey S; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France., Perrin-Terrin M; Aix Marseille University, CNRS/IN2P3, CPPM, Marseille, France. |
| Source: | Micromachines [Micromachines (Basel)] 2023 Jun 24; Vol. 14 (7). Date of Electronic Publication: 2023 Jun 24. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: MDPI Country of Publication: Switzerland NLM ID: 101640903 Publication Model: Electronic Cited Medium: Print ISSN: 2072-666X (Print) Linking ISSN: 2072666X NLM ISO Abbreviation: Micromachines (Basel) Subsets: PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
Be the first to leave a comment!
