Monolithic three-dimensional integration of RRAM-based hybrid memory architecture for one-shot learning.
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| Title: | Monolithic three-dimensional integration of RRAM-based hybrid memory architecture for one-shot learning. |
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| Authors: | Li Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Tang J; School of Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn., Gao B; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Yao J; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Fan A; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China., Yan B; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China., Yang Y; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China.; School of Electronic and Computer Engineering, Peking University, Shenzhen, China.; Center for Brain Inspired Intelligence, Chinese Institute for Brain Research (CIBR), Beijing, China., Xi Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Li Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Li J; School of Integrated Circuits, Tsinghua University, Beijing, China., Sun W; School of Integrated Circuits, Tsinghua University, Beijing, China., Du Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Liu Z; School of Integrated Circuits, Tsinghua University, Beijing, China., Zhang Q; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Qiu S; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Li Q; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Qian H; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Wu H; School of Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn. |
| Source: | Nature communications [Nat Commun] 2023 Nov 06; Vol. 14 (1), pp. 7140. Date of Electronic Publication: 2023 Nov 06. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 2041-1723 |
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| DOI: | 10.1038/s41467-023-42981-1 |
