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Monolithic three-dimensional integration of RRAM-based hybrid memory architecture for one-shot learning.

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Title: Monolithic three-dimensional integration of RRAM-based hybrid memory architecture for one-shot learning.
Authors: Li Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Tang J; School of Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn., Gao B; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Yao J; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Fan A; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China., Yan B; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China., Yang Y; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China.; School of Electronic and Computer Engineering, Peking University, Shenzhen, China.; Center for Brain Inspired Intelligence, Chinese Institute for Brain Research (CIBR), Beijing, China., Xi Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Li Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Li J; School of Integrated Circuits, Tsinghua University, Beijing, China., Sun W; School of Integrated Circuits, Tsinghua University, Beijing, China., Du Y; School of Integrated Circuits, Tsinghua University, Beijing, China., Liu Z; School of Integrated Circuits, Tsinghua University, Beijing, China., Zhang Q; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Qiu S; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Li Q; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China., Qian H; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China., Wu H; School of Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.
Source: Nature communications [Nat Commun] 2023 Nov 06; Vol. 14 (1), pp. 7140. Date of Electronic Publication: 2023 Nov 06.
Publication Type: Journal Article
Journal Info: Publisher: Nature Pub. Group Country of Publication: England NLM ID: 101528555 Publication Model: Electronic Cited Medium: Internet ISSN: 2041-1723 (Electronic) Linking ISSN: 20411723 NLM ISO Abbreviation: Nat Commun Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: <searchLink fieldCode="AU" term="%22Li+Y%22">Li Y</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Tang+J%22">Tang J</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. jtang@tsinghua.edu.cn.<br /><searchLink fieldCode="AU" term="%22Gao+B%22">Gao B</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Yao+J%22">Yao J</searchLink>; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China.<br /><searchLink fieldCode="AU" term="%22Fan+A%22">Fan A</searchLink>; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Yan+B%22">Yan B</searchLink>; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Yang+Y%22">Yang Y</searchLink>; Institute for Artificial Intelligence, Peking University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing, China.; School of Electronic and Computer Engineering, Peking University, Shenzhen, China.; Center for Brain Inspired Intelligence, Chinese Institute for Brain Research (CIBR), Beijing, China.<br /><searchLink fieldCode="AU" term="%22Xi+Y%22">Xi Y</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Li+Y%22">Li Y</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Li+J%22">Li J</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Sun+W%22">Sun W</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Du+Y%22">Du Y</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Liu+Z%22">Liu Z</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Zhang+Q%22">Zhang Q</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Qiu+S%22">Qiu S</searchLink>; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China.<br /><searchLink fieldCode="AU" term="%22Li+Q%22">Li Q</searchLink>; Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science, Suzhou, China.<br /><searchLink fieldCode="AU" term="%22Qian+H%22">Qian H</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China.<br /><searchLink fieldCode="AU" term="%22Wu+H%22">Wu H</searchLink>; School of Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.; Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University, Beijing, China. wuhq@tsinghua.edu.cn.
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