Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers-A Case Study of Wafer Fabrication Plant F.
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| Title: | Investigating a Machine Learning Approach to Predicting White Pixel Defects in Wafers-A Case Study of Wafer Fabrication Plant F. |
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| Authors: | Shih DH; Department of Information Management, National Yunlin University of Science and Technology, Douliu 64002, Taiwan., Yang CY; Formosa Sumco Technology Corporation, Yunlin County 638501, Taiwan., Wu TW; Department of Information Management, National Yunlin University of Science and Technology, Douliu 64002, Taiwan., Shih MH; Department of Electrical and Computer Engineering, Iowa State University, 2520 Osborn Drive, Ames, IA 50011, USA. |
| Source: | Sensors (Basel, Switzerland) [Sensors (Basel)] 2024 May 15; Vol. 24 (10). Date of Electronic Publication: 2024 May 15. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220 (Electronic) Linking ISSN: 14248220 NLM ISO Abbreviation: Sensors (Basel) Subsets: MEDLINE; PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 1424-8220 |
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| DOI: | 10.3390/s24103144 |
