| Authors: |
Huff JS; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Patten LK; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Turner DB; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Knowlton WB; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Lee J; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Chemistry & Biochemistry, Boise State University, Boise, Idaho 83725, United States., Yurke B; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Pensack RD; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States. |