| Authors: |
Piantanida L; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Dickinson GD; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Majikes JM; National Institute of Standards and Technology, Gaithersburg, Maryland 20878, United States., Clay W; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States., Liddle JA; National Institute of Standards and Technology, Gaithersburg, Maryland 20878, United States., Andersen T; Department of Computer Science, Boise State University, Boise, Idaho 83725, United States., Hayden EJ; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States.; Department of Biological Sciences, Boise State University, Boise, Idaho 83725, United States., Kuang W; Department of Electrical & Computer Engineering, Boise State University, Boise, Idaho 83725, United States., Hughes WL; Micron School of Materials Science & Engineering, Boise State University, Boise, Idaho 83725, United States. |
