| Authors: |
Labed M; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Moon JY; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Kim SI; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Park JH; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Kim JS; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Venkata Prasad C; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Bae SH; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Rim YS; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea. |
