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2D Embedded Ultrawide Bandgap Devices for Extreme Environment Applications.

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Title: 2D Embedded Ultrawide Bandgap Devices for Extreme Environment Applications.
Authors: Labed M; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Moon JY; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Kim SI; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Park JH; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Kim JS; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Venkata Prasad C; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea., Bae SH; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States., Rim YS; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea.
Source: ACS nano [ACS Nano] 2024 Nov 05; Vol. 18 (44), pp. 30153-30183. Date of Electronic Publication: 2024 Oct 22.
Publication Type: Journal Article; Review
Journal Info: Publisher: American Chemical Society Country of Publication: United States NLM ID: 101313589 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1936-086X (Electronic) Linking ISSN: 19360851 NLM ISO Abbreviation: ACS Nano Subsets: MEDLINE; PubMed not MEDLINE
Database: MEDLINE Ultimate
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  Data: <searchLink fieldCode="AU" term="%22Labed+M%22">Labed M</searchLink>; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Moon+JY%22">Moon JY</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Kim+SI%22">Kim SI</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Park+JH%22">Park JH</searchLink>; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Kim+JS%22">Kim JS</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Venkata+Prasad+C%22">Venkata Prasad C</searchLink>; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea.<br /><searchLink fieldCode="AU" term="%22Bae+SH%22">Bae SH</searchLink>; Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.; Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, Missouri 63130, United States.<br /><searchLink fieldCode="AU" term="%22Rim+YS%22">Rim YS</searchLink>; Department of Semiconductor Systems Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.; Institute of Semiconductor and System IC, Sejong University Seoul, Seoul 05006, Republic of Korea.
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  Data: <searchLink fieldCode="JN" term="%22101313589%22">ACS nano</searchLink> [ACS Nano] 2024 Nov 05; Vol. 18 (44), pp. 30153-30183. <i>Date of Electronic Publication: </i>2024 Oct 22.
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  Data: <i>Publisher: </i><searchLink fieldCode="PB" term="%22American+Chemical+Society%22">American Chemical Society </searchLink><i>Country of Publication: </i>United States <i>NLM ID: </i>101313589 <i>Publication Model: </i>Print-Electronic <i>Cited Medium: </i>Internet <i>ISSN: </i>1936-086X (Electronic) <i>Linking ISSN: </i><searchLink fieldCode="IS" term="%2219360851%22">19360851 </searchLink><i>NLM ISO Abbreviation: </i>ACS Nano <i>Subsets: </i>MEDLINE; PubMed not MEDLINE
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        Value: 10.1021/acsnano.4c09173
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              Text: 2024 Nov 05
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