Bioelastic state recovery for haptic sensory substitution.
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| Title: | Bioelastic state recovery for haptic sensory substitution. |
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| Authors: | Flavin MT; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Ha KH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Guo Z; School of Engineering, Westlake University, Hangzhou, China., Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Kim JT; Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang, Republic of Korea., Saxena T; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Simatos D; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Al-Najjar F; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA., Mao Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.; Institute of Biomedical Manufacturing and Life Quality Engineering, State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China., Bandapalli S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Fan C; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Bai D; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Dalian University of Technology, Dalian, China.; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.; DUT-BSU Joint Institute, Dalian University of Technology, Dalian, China., Zhang Z; School of Engineering, Westlake University, Hangzhou, China., Zhang Y; School of Engineering, Westlake University, Hangzhou, China., Flavin E; Center for Education Integrating Science, Mathematics, and Computing, Georgia Institute of Technology, Atlanta, GA, USA., Madsen KE; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Chemistry, University of Illinois Urbana-Champaign, Urbana, IL, USA., Huang Y; School of Engineering, Westlake University, Hangzhou, China., Emu L; School of Engineering, Westlake University, Hangzhou, China., Zhao J; School of Engineering, Westlake University, Hangzhou, China., Yoo JY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon, Republic of Korea., Park M; Department of Polymer Science and Engineering, Dankook University, Yongin, Republic of Korea., Shin J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.; Molecular Recognition Research Center, Korea Institute of Science and Technology, Seoul, Republic of Korea., Huang AG; School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Shin HS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA., Colgate JE; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA., Huang Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Civil & Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.; Department of Materials Science & Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu., Xie Z; State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn.; Department of Engineering Mechanics, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn.; DUT-BSU Joint Institute, Dalian University of Technology, Dalian, China. zxie@dlut.edu.cn., Jiang H; School of Engineering, Westlake University, Hangzhou, China. hanqing.jiang@westlake.edu.cn.; Westlake Institute for Advanced Study, Hangzhou, China. hanqing.jiang@westlake.edu.cn.; Research Center for Industries of the Future and School of Engineering, Westlake University, Hangzhou, China. hanqing.jiang@westlake.edu.cn., Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Materials Science & Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.; Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA. jrogers@northwestern.edu. |
| Source: | Nature [Nature] 2024 Nov; Vol. 635 (8038), pp. 345-352. Date of Electronic Publication: 2024 Nov 06. |
| Publication Type: | Journal Article; Research Support, Non-U.S. Gov't |
| Journal Info: | Publisher: Nature Publishing Group Country of Publication: England NLM ID: 0410462 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1476-4687 (Electronic) Linking ISSN: 00280836 NLM ISO Abbreviation: Nature Subsets: MEDLINE |
| Database: | MEDLINE Ultimate |
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