| Authors: |
Trivedi JK; Department of Chemical Engineering, The City College of New York, City University of New York, 160 Convent Avenue, New York, NY 10031, USA. Electronic address: jtrived001@citymail.cuny.edu., Moutushi T; Department of Chemical Engineering, The City College of New York, City University of New York, 160 Convent Avenue, New York, NY 10031, USA. Electronic address: tasnuva.moutushi@intel.com., Burra KR; Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. Electronic address: kiranraj@umd.edu., Gupta AK; Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA. Electronic address: akgupta@umd.edu., Castaldi MJ; Department of Chemical Engineering, The City College of New York, City University of New York, 160 Convent Avenue, New York, NY 10031, USA. Electronic address: mcastaldi@ccny.cuny.edu. |
