| Authors: |
Zhou P; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA., Edwards AJ; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA., Mancoff FB; Everspin Technologies Inc., Chandler, AZ, USA., Aggarwal S; Everspin Technologies Inc., Chandler, AZ, USA. sanjeev.aggarwal@everspin.com., Heinrich-Barna SK; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA.; Texas Instruments Inc., Dallas, TX, USA., Friedman JS; Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, TX, USA. joseph.friedman@utdallas.edu. |
