Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity.
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| Title: | Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. |
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| Authors: | Sung YC; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Hu CP; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Hwang SJ; Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan., Shih MH; Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Tainan 710301, Taiwan., Liao WH; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan., Zeng YJ; Packaging Product Simulation and Design Division, Innolux Corporation, Tainan 744092, Taiwan., Tsai CT; Testing Center, Innolux Corporation, Tainan 744092, Taiwan. |
| Source: | Polymers [Polymers (Basel)] 2025 Jul 25; Vol. 17 (15). Date of Electronic Publication: 2025 Jul 25. |
| Publication Type: | Journal Article |
| Journal Info: | Publisher: MDPI Country of Publication: Switzerland NLM ID: 101545357 Publication Model: Electronic Cited Medium: Internet ISSN: 2073-4360 (Electronic) Linking ISSN: 20734360 NLM ISO Abbreviation: Polymers (Basel) Subsets: PubMed not MEDLINE |
| Database: | MEDLINE Ultimate |
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| ISSN: | 2073-4360 |
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| DOI: | 10.3390/polym17152034 |
