APA (7th ed.) Citation

YC, S., CP, H., SJ, H., MH, S., WH, L., YJ, Z., & CT, T. (2025). Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. Polymers, 17(15), . https://doi.org/10.3390/polym17152034

Chicago Style (17th ed.) Citation

YC, Sung, Hu CP, Hwang SJ, Shih MH, Liao WH, Zeng YJ, and Tsai CT. "Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity." Polymers 17, no. 15 (2025). https://doi.org/10.3390/polym17152034.

MLA (9th ed.) Citation

YC, Sung, et al. "Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity." Polymers, vol. 17, no. 15, 2025, https://doi.org/10.3390/polym17152034.